I. Technical status
The silicon evaporated film is a micron-scale film formed by vapor deposition of silicon monoxide in vacuum. Since silicon monoxide is very unstable, it is easily oxidized into silicon dioxide, so it is often referred to as SiOx in the formulae where x is between 1 and 2. In principle, evaporation techniques that can be used for vacuum deposition can all be used to form a silicon evaporated film, but different methods have different requirements for the composition of the evaporation source material, and the resulting film composition is also different. In addition to evaporating a SiOx film in a vacuum chamber using conventional resistance heating or high-frequency induction heating, an SiOx film can also be deposited using electron beams (EB) and a low temperature plasma (Plasma). The SiOx film for barrier flexible packaging was prepared by low temperature plasma at a temperature of 40-50 °C and a vacuum of 0.75 mmHg. At the same time, a research institute in California also used commercialized plasma enhanced chemical vapor deposition (PECVD) equipment to manufacture SiOx membranes for food packaging. In Japan, it has been reported that a SiOx film is plated on a PET material using argon ion sputtering. The composition of the target used was SiO2, 74%; CaO, 0%; NaO, 16%, almost a component of common soda lime glass. In addition to evaporating SiOx films on plastic films, research on the plating of other inorganic materials with special properties has begun. The research trends of these new materials deserve our close attention.
Second, the structure and performance of composite flexible packaging materials
The flexible packaging material containing the SiOx evaporated film is usually composed of three layers: the SiOx film is sandwiched between two plastic films to protect the SiOx film from being damaged. The substrates that can be used for vapor deposition of SiOx film include PET, LDPE, OPP, and ON. The other plastic film that is compounded with it may be polypropylene, polystyrene, polyamide, or the like. From the viewpoint of easy recycling, the same resin can be used for the two-layer plastic film, such as OPP for the outer layer and CPP for the inner layer.
Compared to composites with PVDC as the barrier layer, the vapor permeability of silicon evaporated composites is less affected by temperature. For example, when the temperature is increased from 20°C to 50°C, the oxygen permeability of PET/SiOx/CPP increases from 0.21 to 0.5cm3/m2•24h; Under the same conditions, the oxygen permeability of PET/PVDC/CPP is increased. From 1.2 to 14.2 cubic centimeters per square meter • 24 hours.
Silicon vapor deposition composite flexible packaging material not only has excellent barrier properties, but also transparent, heat-resistant, can be suitable for microwave heating. These properties are not available in aluminum foil composites. Transparent soft packaging will undoubtedly greatly promote sales.
The disadvantage of the SiOx plating material is that it cannot be heat-sealed. When no composite structure protection is provided, the SiOx layer is brittle. Because it is very thin, it has good resistance to cracking and folding after proper lamination.
Third, application prospects
Silicon vapor deposition composite flexible packaging materials are widely used. For example, it can be used to package dry foods and high-water food or liquid foods. Can also be used for toothpaste, spices, disposable packaging and a variety of industrial products, chemical products used in composite packaging materials.
The silicon evaporated film is a micron-scale film formed by vapor deposition of silicon monoxide in vacuum. Since silicon monoxide is very unstable, it is easily oxidized into silicon dioxide, so it is often referred to as SiOx in the formulae where x is between 1 and 2. In principle, evaporation techniques that can be used for vacuum deposition can all be used to form a silicon evaporated film, but different methods have different requirements for the composition of the evaporation source material, and the resulting film composition is also different. In addition to evaporating a SiOx film in a vacuum chamber using conventional resistance heating or high-frequency induction heating, an SiOx film can also be deposited using electron beams (EB) and a low temperature plasma (Plasma). The SiOx film for barrier flexible packaging was prepared by low temperature plasma at a temperature of 40-50 °C and a vacuum of 0.75 mmHg. At the same time, a research institute in California also used commercialized plasma enhanced chemical vapor deposition (PECVD) equipment to manufacture SiOx membranes for food packaging. In Japan, it has been reported that a SiOx film is plated on a PET material using argon ion sputtering. The composition of the target used was SiO2, 74%; CaO, 0%; NaO, 16%, almost a component of common soda lime glass. In addition to evaporating SiOx films on plastic films, research on the plating of other inorganic materials with special properties has begun. The research trends of these new materials deserve our close attention.
Second, the structure and performance of composite flexible packaging materials
The flexible packaging material containing the SiOx evaporated film is usually composed of three layers: the SiOx film is sandwiched between two plastic films to protect the SiOx film from being damaged. The substrates that can be used for vapor deposition of SiOx film include PET, LDPE, OPP, and ON. The other plastic film that is compounded with it may be polypropylene, polystyrene, polyamide, or the like. From the viewpoint of easy recycling, the same resin can be used for the two-layer plastic film, such as OPP for the outer layer and CPP for the inner layer.
Compared to composites with PVDC as the barrier layer, the vapor permeability of silicon evaporated composites is less affected by temperature. For example, when the temperature is increased from 20°C to 50°C, the oxygen permeability of PET/SiOx/CPP increases from 0.21 to 0.5cm3/m2•24h; Under the same conditions, the oxygen permeability of PET/PVDC/CPP is increased. From 1.2 to 14.2 cubic centimeters per square meter • 24 hours.
Silicon vapor deposition composite flexible packaging material not only has excellent barrier properties, but also transparent, heat-resistant, can be suitable for microwave heating. These properties are not available in aluminum foil composites. Transparent soft packaging will undoubtedly greatly promote sales.
The disadvantage of the SiOx plating material is that it cannot be heat-sealed. When no composite structure protection is provided, the SiOx layer is brittle. Because it is very thin, it has good resistance to cracking and folding after proper lamination.
Third, application prospects
Silicon vapor deposition composite flexible packaging materials are widely used. For example, it can be used to package dry foods and high-water food or liquid foods. Can also be used for toothpaste, spices, disposable packaging and a variety of industrial products, chemical products used in composite packaging materials.
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