Researchers at the Food Technology Center of Gueph University in Ontario, Canada recently developed a new type of PEN polyethylene tea-phenolic resin that is resistant to high-heat food packaging materials. The PEN/PET new material is formed by using the PEN polyethylene tea phenol resin material and the current traditional food packaging material PET polyethylene terephthalate mixture, and has the advantages of high heat resistance, resistance to embrittlement, fear of moisture, and oxidation resistance. And resistance to ultraviolet radiation and other advantages. Because the new food packaging material has the characteristics of high heat resistance, the food packaging can be completed in the high temperature treatment, so the food life can be effectively extended.
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