A method for manufacturing a buffer pack for placing a product into a package and a device for manufacturing the same Patent applicant Applicant Corporation SUN A. Chemical Engineering main applicant Address Tokyo, Japan Inventor Tanaka Kenzo; Pusuke Daisuke; Yuda Zhou Show Application (patent) No. 03819916.5 Date of application 2003.05.29 Approval date Approval notice No. 1678495 Date of approval announcement 2005.10.05 Specification CD No. D0540 Main classification number B65B61/00 Classification No. B65B61/00; B65D81/07 Sub-division Original application No. Priority 2002.9.4 JP 259398/2002 Abstract A device for manufacturing a cushion package that is to be packaged includes a buffer plate forming device (8) for heat-sealing a long-sized soft resin plate that is transported in a longitudinal direction. , and forming a buffer plate (1) having vesicles extending in the width direction of the plate; and an article accommodating space forming device (3) continuously provided with the buffer plate forming device (8) for passing the buffer plate ( 1) Stacking to form an article storage space (1c); a plate bonding apparatus (4) for bonding between overlapping buffer plates (1); an article arranging device (5) for the Be The package (C) is disposed in the article accommodating space (1c) and an air filling device (6) is used to fill the small bubbles with air. By passing the long-sized soft resin plate through a series of devices as described above, the buffer package that is to be packaged can be easily machined. SATUM 1, a method for manufacturing a cushion package to be packaged, characterized by comprising a first step of superimposing a long-sized soft resin sheet (10) continuously conveyed in the longitudinal direction. Heat-sealing to extend the plate in the width direction to form a buffer plate (1) having at least one end of the vesicles (11) for filling the air inlet portion (11a). The second step is from the first step. In a continuous process, the buffer plate (1) is folded in the longitudinal direction, and the ends of the overlapped buffer plate (1) other than the portion for receiving the article-containing opening (1d) are adhered to form a blister. (11) The enclosed space, ie, the article storage space (1c), and the third step, which arranges the packaged article (C) to the article through the inlet portion of the article storage space (1c), ie, the article storage opening (1d). In the accommodation space (1c), in the fourth step, the vesicle (11) is filled with air to inflate it, and the article storage opening (1d) and the inlet (11a) of the vesicle (11) are bonded together. It is closed, and each step is performed in the order described above. International Application PCT/JP2003/006723 2003.5.29 International Publication WO2004/022432 Date 2004.3.18 Date of Entry into the Country Patent Agencies China Council for the Promotion of International Trade Patent and Trademark Office Agency Address Agent He Tengyun
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