High-performance polyimide resin improves package efficiency

According to reports, the Institute of Chemistry of the Chinese Academy of Sciences has successfully developed photosensitive BTPA-1000 and standard BTDA-1000 polyimide resins for VLSI VLSI packaging materials.

These special resins have a small volume shrinkage, a low curing temperature, and a good storage stability of the resin. Among them, the photosensitive BTPA-1000 polyimide resin has a special photocross-linking mechanism and can be lithographically patterned without the addition of other photosensitizers. Moreover, foreign contamination on the surface of the IC chip can be avoided to a maximum degree, and the multi-layer wiring technology is suitable for manufacturing a multilayer metal interconnect structure or chip passivation.

A number of semiconductor companies and research institutes in China have prepared this new type of resin for the manufacture of chips and optoelectronic devices. The industrial pilot plant with an annual output of tens of tons is under construction and is expected to be put into production in July this year.